Principal HW Development Engr

As the Principal HW Development Engr, you will play a vital role in our Optical Networks Product & Solutions Engineering HW & Test team. Your expertise in thermal engineering will be crucial in developing innovative hardware solutions. You will collaborate closely with cross-functional teams to deliver high-quality products that meet our customers' expectations.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world. 

Our recruitment process

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If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia. 

• Lead and manage thermal design and testing activities for hardware products.
• Perform advanced thermal simulations using Flotherm and other tools, optimizing the number of simulations for efficient design.
• Choose and design heat sinks, fans, heat pipes, and TIMs for effective electronics cooling.
• Create clear and concise reports with recommendations based on thermal analysis and testing data.
• Ensure compliance with environmental standards such as NEBS, ETSI, and GR-3108 from a thermal perspective.
• Work closely with mechanical engineers to understand and address mechanical design limitations and constraints.
• Collaborate with cross-functional teams, including hardware, software, and manufacturing engineers, to integrate thermal solutions effectively.
• Stay updated with the latest advancements in thermal engineering and incorporate best practices into our designs.
• Mentor and guide junior engineers, fostering a culture of continuous learning and improvement.

• Minimum 12 years of experience in electronics cooling and thermal design, with a strong background in PCBA thermal design.
• Expertise in Flotherm with at least 5 years of experience, and a working knowledge of Creo is desirable.
• Independent thermal testing experience of at least 5 years for line cards, racks, sub-racks, and power supplies.
• Knowledge of airflow impedance testing and acoustics testing for telecom applications.
• Experience with thermocouples, airflow sensors, and thermal chambers for PCBA and rack-level testing.
• Understanding of EUT/traffic bring-up and the ability to use software tools for test data logging.
• Familiarity with mechanical design principles and limitations, including mounting mechanisms and design considerations.
• Strong analytical and problem-solving skills, with a methodical and data-driven approach to optimization.
• Excellent communication and collaboration skills, with the ability to work effectively in a cross-functional team environment.
• A bachelor's or master's degree in Electrical/Electronics Engineering or a related field is preferred.