Lead Engineer - Electronics Category

1. Lead multiple large‑scale and complex cost out and resiliency improvement projects and programs from concept through execution, ensuring technical robustness, feasible business case, stakeholders alignment, and schedule adherence.
2. Develop and execute category strategies in collaboration with Global Category Managers, global procurement, product development teams and product line managers.
3. Identify high quality cost out and resiliency ideas, prepare business case proposals, including technical and commercial assessments, and secure stakeholder alignment to launch new projects.
4. Partner with global cross functional teams and suppliers to develop, validate, and industrialize new or improved products on time.
5. Mentor, coach, and review the work of junior engineers, ensuring technical excellence and adherence to best practices.
6. Prepare project plans, also develop validation plans (DVPs) in accordance with international product certification standards like UL, IEC, ATEX etc.
7. Foster a culture of innovation and continuously grow the VAVE pipeline and execution efficiency.
8. Support capability development within the team through training, tools, methodologies, and knowledge sharing.
9. Utilization of engineering fundamentals, innovation, data analysis, manufacturing process details for the creation of new ideas.
10. Analyze spend data for finding out opportunities for cost out in different type Electronics Components & Assemblies. Experience of handling supplier discussions, leading costout/VAVE projects.
11. Proficient in Product Teardown analysis, Design and Competitive Benchmarking, Function analysis, and leading technical evaluations for decision-making.
12. Demonstrates the application of basic Engineering tools/ principles and evidence of creative thinking through component selection, preliminary validation through simulations or engineering analytics.
13. Confers with manufacturing, Product teams, suppliers to resolve Design for Manufacturing, Design for Testing, Design for Assembly issues.
14. Applicant should have experience of leading global projects, working with global team members & stakeholders. Should possess strong communication & interpersonal skills.
15. Mentor, organize, lead, and champion projects leveraging Data Sources, resources and cross functional team
16. Understanding on electronic devices-hardware, firmware, interfaces.
17. Strong knowledge of global design standards (IEC, UL, CSA, NEMA) and compliance testing such as short circuit, temperature rise, and arc tests per IEEE/IEC/UL standards.
18. Hands-on experience in plants for resolving technical issues, driving LEAN initiatives, and DFSS-certified for early risk identification and robust product development.

Education level required :

Bachelor's or Masters in Electronics/E&TC
Years and area of experience required

1. Total relevant work experience: 8 to 15 years. 
2. Significant hands-on experience with various electronics components selection and design methodologies.
3. Understanding of electronic component specifications, lifecycles, and industry standards.
4. Awareness of applicable standards and environmental compliances – IEC / UL / ISO / RoHS / REACH etc.
5. Sound knowledge on spend data analysis.
6. Strong analytical & problem-solving skills.

Technical knowledge

1.Understanding of electronic component specifications, lifecycles, and industry standards. 
2. Strong knowledge in Electronics Component Selection, Bare PCB & PCB Assembly process.
3. Knowledge on Design, testing and validation of various Hardware products.

Soft skills

1. Work & interact with global cross-functional and cross-cultural team. 
2. Good interpersonal skills, ability to clearly communicate to internal/external customers and suppliers.